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5W UV Laser Marking Machine in Stone/ Glass Material/ Complex Graphics Cutting of Silicon Wafers

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5W UV Laser Marking Machine in Stone/ Glass Material/ Complex Graphics Cutting of Silicon Wafers
5W UV Laser Marking Machine in Stone/ Glass Material/ Complex Graphics Cutting of Silicon Wafers
5W UV Laser Marking Machine in Stone/ Glass Material/ Complex Graphics Cutting of Silicon Wafers
5W UV Laser Marking Machine in Stone/ Glass Material/ Complex Graphics Cutting of Silicon Wafers
5W UV Laser Marking Machine in Stone/ Glass Material/ Complex Graphics Cutting of Silicon Wafers

Key attributes

Industry-specific attributes

working accuracy
0.02mm
laser type
UV

Other attributes

graphic format supported
AI, PLT, DXF, BMP, JPG
condition
New
place of origin
Hubei, China
laser source brand
RAYCUS
weight (kg)
60 KG
key selling points
High-accuracy
warranty
2 years
marking area
110mm*110mm
mode of operation
Pulsed
configuration
bench-top
feature
Water-cooled
Cooling System
WATER COOLING
control software
EZCAD_V2

Packaging and delivery

Selling Units:
Single item
Single package size:
80X90X90 cm
Single gross weight:
70.000 kg

Lead time

Product descriptions from the supplier

1 - 9 pieces
$3,935.00
>= 10 pieces
$3,855.00

Variations

Total options:1 power(w);1 model number.
Select now

power(w)(1): 5w

5w

model number(1)

JS-UVM5

Shipping

Shipping fee and delivery date to be negotiated. Chat with supplier now for more details.

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1-year warranty

Access to free parts replacement and repair coverage