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Customize Ejector Pin Needle (Pink) Tungsten Carbide (WC) Dia 0.020-0.700 for Semiconductor Die Ejection Process

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Customize Ejector Pin Needle (Pink) Tungsten Carbide (WC) Dia 0.020-0.700 for Semiconductor Die Ejection Process
Customize Ejector Pin Needle (Pink) Tungsten Carbide (WC) Dia 0.020-0.700 for Semiconductor Die Ejection Process
Customize Ejector Pin Needle (Pink) Tungsten Carbide (WC) Dia 0.020-0.700 for Semiconductor Die Ejection Process
Customize Ejector Pin Needle (Pink) Tungsten Carbide (WC) Dia 0.020-0.700 for Semiconductor Die Ejection Process
Customize Ejector Pin Needle (Pink) Tungsten Carbide (WC) Dia 0.020-0.700 for Semiconductor Die Ejection Process

Key attributes

Industry-specific attributes

Machine Type
die bonder machine, other

Other attributes

weight (kg)
0.0008
warranty
3 months
place of origin
Malaysia
video outgoing-inspection
Not Available
machinery test report
Not Available
brand name
Leader Range Hitech
Material
Carbide (WC)
Packaging
40pcs / Box
Logistic Mode
Air Freight
Condition
New
Showroom Location
Malaysia
Applicable Industries
Semicon Die Bond Machine
Marketing Type
Machine Part
Core Components
Single component product

Customization

Product descriptions from the supplier

Minimum order quantity: 100 pieces
$1.50-3.00

Quantity

Shipping

Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00 - $0.00
Shipping total
$0.00

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